The advancement of PC processors is growing
rapidly on a global scale. From 500 MHz to more than
4 GHz, today’s thermal technology is required to have
higher functionality and extreme performance. Today,
Thermaltake is bringing you a new part of CPU cooling
code named SubZero4G?. SubZero4G? will be the ultimate
solution for today’s high-speed processor.
SubZero4G? is available in three platforms:
Intel P4 478, AMD Athlon XP and Opteron K8,
to accommodate users’ demand.
Microprocessor-controlled
thermo-electric cooling Designed
specifically for high speed processors (Applicable with
Intel
Intel P4 478, AMD Athlon XP and Opteron K8) Significantly
reduces fan noise Installs
in under 90 seconds Power
is independent from power supply unit LED
case shows 3-step variations in different stress Patents
pending
SubZero4G? Components
What
is TEC
TEC, which stands for "Thermal
Electric Cooling", is based on the Peltier Effect.
It was first discovered in the early 19th century.
DC current passes through the thermo-electric device
causing heat to be absorbed at one side and releasing
to the opposite side during operation.
One-slot
PCI Card
(Click image for details)
Spotlights
SubZero4G? is designed for PC users who
need lower noise level and improved performance.
SubZero4G TM comprises a cooling unit, a PCI card
(power and control unit) and a LED case fan.
The cooling unit consists of a cold plate,
a thermo-electric module, a heat sink, and a CPU
fan. The cold plate is directly mounted on the CPU.
The thermo-electric module carries
the heat from the cold plate to the heat sink. The
CPU fan takes away the heat and case fans remove
the heat to outside the case.
The PCI card includes an AC/DC power
supply and a microprocessor. The microprocessor
detects the temperature by ambient and CPU temperature
sensors and then outputs adequate power to CPU and
case fans. In short, the 3-step fan speed
is controlled by the microprocessor.
Noise
Control
3-step fan speed controlled by microprocessor.Physics
of TEC unit makes it possible to reduce noise
without compromising cooling.
The transparent fan with three blue LED
lights gives users the chance to experience the
SILENT and 3-step variations in different
stress.
How
thermo-electric effect reduces fan noise without compromising
cooling
In a conventional cooler, the CPU is in
direct contact with the heat sink. If fan speed is reduced,
the heat sink will become hotter. The CPU, which is
in contact with the heat sink, will also become hotter.
In contrast, in a TEC cooler, the CPU is isolated from
the heatsink by the thermo-electric unit (a solid-state
heat pump). If fan speed is reduced, the heat sink will
become hotter. But the thermo-electric unit continues
to pump heat from the CPU to the heatsink. Noise can
be reduced while maintaining the same level of cooling
of the CPU. This is not possible with conventional air
cooling.
Figure 1
Figure 2
In a conventional cooler, when the fan
voltage is reduced to reduce noise (Graph 2), the heat
sink temperature immediately increases (Graph 4). At
the same time, the temperature of the CPU will increase
accordingly (Graph 5).
In a TEC cooler, when the fan voltage is reduced to
reduce noise (Graph 1), the heat sink temperature increases
(Graph 3). By pumping more heat from the cold plate
to the heat sink, the thermo-electric unit keeps the
temperature of the cold plate and CPU low (constant
for typical applications). Using Thermaltake thermo-electric
cooling technology, computer noise can be reduced without
compromising cooling.
Detail
Specifications- Intel P4 478 up to 4GHz
P/N
A1614
A1615
A1616
Performance
Cooling
(Max. CPU temp.)
CPU Temp.
Ambient Temp.
Ilde
28.0
25.0
3DMark2001SE
1024x786x32 bits
45.0
33.5
P4maxpower6
75%
55.0
34.5
All tests performance
at room temperature 25oC using Intel
P4 3.06GHz. Temperature was measured
at a groove in the CPU case.Tests results
may vary depending on case design and
air flow.
Noise level,
CPU fan
21-38dBA, dependent
on load, < 25dBA in typical operation,
dynamically controlled by microprocessor;
patent-pending noise-reduction technology
Noise level,
Case fans
3-step microprocessor-controlled:
6, 8, 12 VDC, control according to PC
ambient temperature and CPU temperature;
smart noise-reduction algorithms
Response time to CPU
temperature change
< 1 second (reduces
hot-spot effect)
PCI Card
Dimension
190 x 114 x22 mm
InputVoltage
90-240 VAC, 50-60
Hz
Power Consumption
from Mains
CPU
in sleep mode: 4W
CPU in typical mode
(running office programs): ~15W
CPU under maximum load: 73W
80
x 80 x 25 mm, 12V, 2000±10%RPM,
1.98 mmH2O, 27.8 CFM, 21 dBA, Sleeve
Thermo-Electric Unit
40 x 80 mm
Power Cord
Plug
USA, Europe, and
UK
Detail
Specifications- AMD Athlon XP up to 3400+
P/N
A1617
A1618
A1619
Performance
Cooling
(Max. CPU temp.)
Silent
Mode
CPU Temp.
Ambient Temp.
Ilde
34.7
29.5
3DMark2001SE
1024x786x32 bits
38.0
32.0
P4maxpower6
75%
53.5
36.0
Power
Mode
CPU Temp.
Ambient Temp.
Ilde
36.1
32.5
3DMark2001SE
1024x786x32 bits
38.6
3.5
P4maxpower6
75%
46.6
33.5
All tests performance at room temperature
25oC using AMD XP 2200+. Temperature
was
measured on the back side of the CPU
die. Tests results may vary depending
on case
design and air flow.
Noise level,
CPU fan
21-38dBA, dependent
on load, < 25dBA in typical operation,
dynamically controlled by microprocessor;
patent-pending noise-reduction technology
Noise level,
Case fans
3-step microprocessor-controlled:
6, 8, 12 VDC, control according to PC
ambient temperature and CPU temperature;
smart noise-reduction algorithms
Response time to CPU
temperature change
< 1 second (reduces
hot-spot effect)
PCI Card
Dimension
190 x 114 x22 mm
InputVoltage
90-240 VAC, 50-60
Hz
Power Consumption
from Mains
CPU
in sleep mode: 4W
CPU in typical mode
(running office programs): ~15W
CPU under maximum load: 73W
80
x 80 x 25 mm, 12V, 2000±10%RPM,
1.98 mmH2O, 27.8 CFM, 21 dBA, Sleeve
Thermo-Electric Unit
40 x 80 mm
Power Cord
Plug
USA, Europe, and
UK
(Copper base soldered)
Cooling Function: Silent Mode: In normal applications,
i.e. running Microsoft Office, Internet
Explorer Power Mode: Cool down immediately
in full stress, i.e. playing games
(Click image for detail)
Detail
Specifications- AMD K8
P/N
A1620
A1621
A1622
Performance
Cooling
(Max. CPU temp.)
CPU Temp.
Ambient Temp.
Dummy Board
47.39
26.3
Noise level,
CPU fan
21-39dBA, dependent
on load, < 25dBA in typical operation,
dynamically controlled by microprocessor;
patent-pending noise-reduction technology
Noise level,
Case fans
3-step microprocessor-controlled:
6, 8, 12 VDC, control according to PC
ambient temperature and CPU temperature;
smart noise-reduction algorithms
Response time to CPU
temperature change
< 1 second (reduces
hot-spot effect)
PCI Card
Dimension
190 x 114 x22 mm
InputVoltage
85-265 VAC, 50-60Hz,
automatic
Power Consumption
from Mains
CPU
in sleep mode: 4W
CPU in typical mode
(running office programs): ~15W
CPU under maximum load: 73W
{Sub
Cate}
Features
Microprocessor-controlled
thermo-electric cooling 
SubZero4G? Components
